It is mainly used as curing agent for epoxy resin and other resins. Used in pouring, bonding and FRP fields.
1.USES: organic synthesis intermediate and resin curing agent, adhesive, etc. It can be used in pouring, gluing
and FRP fields.
2.Used as intermediate of organic synthesis and as curing agent and adhesive of epoxy resin. It can be widely
used in epoxy resin adhesion, coating, pouring,sealing, impregnating and composite materials.
3.Used as an organic synthesis intermediate and resin curing agent, binder and so on.
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